MACOM Technology Solutions Holdings IncMACOM unveiled a 3.2T front-end chipset for AI optical interconnects, a new product/R&D development.

MACOM Technology Solutions announced a front-end chipset solution for 3.2T applications designed to accelerate next-generation optical interconnects for artificial intelligence infrastructure. According to a company press release, the chipset delivers up to 3.2 terabits per second of throughput across eight channels operating at 448 gigabits per second PAM-4, a signal modulation technology used to increase data transmission speeds. The solution is engineered to support high-performance data processing across cloud data centers, high-speed networking, and next-generation AI infrastructure. Shares of the network chips maker jumped 4.4% in the afternoon session on the news, trading at $264.04, up 4.9% from the previous close. MACOM is up 50.9% since the beginning of the year, but at $264.04 per share it remains 35.5% below its 52-week high of $409.68 from May 2026.
MACOM Technology Solutions Holdings IncMACOM unveiled a 3.2T front-end chipset for AI optical interconnects, a new product/R&D development.
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