NVIDIA CorporationNVIDIA's GPUs require advanced packaging, and the market growth reflects strong AI demand.
The advanced chip packaging market is projected to grow from $38.6 billion in 2024 to $87.6 billion by 2030, according to BCC Research, driven by demand for AI and high-performance computing. The expansion of AI infrastructure and hyperscale data centers is fueling this growth, with Asia-Pacific leading due to its strong semiconductor ecosystems. Chipmakers and cloud operators are accelerating procurement of advanced packaging solutions to meet needs for improved data throughput, reduced latency, and greater interconnect density.
NVIDIA CorporationNVIDIA's GPUs require advanced packaging, and the market growth reflects strong AI demand.
Broadcom IncBroadcom is a major supplier of advanced packaging solutions, benefiting from AI-driven demand.
Micron Technology IncMicron's memory products are integral to advanced packaging for AI and HPC, driving demand.
Sitime Corporation