Bayerische Motoren Werke AktiengesellschaftBMW is a funder of the CHASSIS program, which develops an innovative automotive chiplet that could benefit its future vehicles.

Allegro DVT announced its contribution to the European CHASSIS program's implementation of the Automotive Base Die chiplet. The 5nm chiplet acts as the central communication and integration hub for automotive System-on-Chip infrastructure, enabling seamless integration of third-party chiplets via the UCIe standard. Funded within the Chips JU program CHASSIS by BMW, imec, and Bosch, the Automotive Base Die aims to enable unprecedented flexibility and innovation in the automotive industry. Allegro DVT provided its Encoding and Decoding Semiconductor Video IP solutions to build optimized video pipelines for in-vehicle camera systems such as ADAS, surround view, and infotainment applications, supporting multiple high-resolution video streams. The solution is designed to meet stringent requirements for memory bandwidth, processing latency, and power consumption while ensuring scalable integration across heterogeneous chiplets.
Bayerische Motoren Werke AktiengesellschaftBMW is a funder of the CHASSIS program, which develops an innovative automotive chiplet that could benefit its future vehicles.
Allegro DVT provided its video IP for the CHASSIS program, showcasing its technology and potentially leading to future orders.
Bosch is a funder of the CHASSIS program, contributing to the development of the Automotive Base Die chiplet.