Amkor Technology IncCustomer commitments exceed Phase 1 capacity, driving expansion.
Amkor Technology is expanding its Arizona advanced packaging and test campus, raising planned investment to approximately $12 billion, with Phase 2 adding 60,000 square meters of cleanroom capacity to reach about 93,000 square meters. Customer commitments have already surpassed the 33,000 square meters planned for Phase 1, which is now fully committed. The expansion supports strategic partnerships with TSMC and NVIDIA, including a 10-year advanced packaging agreement with TSMC and a multi-year NVIDIA partnership for AI infrastructure. Phase 2 construction is expected to begin in late 2027 and complete by the end of 2029. Amkor faces competition from Intel's EMIB-T technology and FormFactor's SmartMatrix for HBM4 testing. Shares have gained 28.4% year to date, and the Zacks Consensus Estimate for 2026 and 2027 earnings is $2.60 and $2.72 per share, respectively.
Amkor Technology IncCustomer commitments exceed Phase 1 capacity, driving expansion.
Taiwan Semiconductor Manufacturing Co. Ltd.10-year advanced packaging agreement with Amkor.
FormFactor IncAmkor's expansion intensifies competition in advanced packaging and testing.
Intel Corporation
NVIDIA CorporationMulti-year partnership with Amkor for AI infrastructure.