Amkor Expands Arizona Packaging Campus to $12 Billion

Product / Tech
โดย Zacks Investment Research·US·Read original
Summary · why it matters

Amkor Technology is expanding its Arizona advanced packaging and test campus, raising planned investment to approximately $12 billion, with Phase 2 adding 60,000 square meters of cleanroom capacity to reach about 93,000 square meters. Customer commitments have already surpassed the 33,000 square meters planned for Phase 1, which is now fully committed. The expansion supports strategic partnerships with TSMC and NVIDIA, including a 10-year advanced packaging agreement with TSMC and a multi-year NVIDIA partnership for AI infrastructure. Phase 2 construction is expected to begin in late 2027 and complete by the end of 2029. Amkor faces competition from Intel's EMIB-T technology and FormFactor's SmartMatrix for HBM4 testing. Shares have gained 28.4% year to date, and the Zacks Consensus Estimate for 2026 and 2027 earnings is $2.60 and $2.72 per share, respectively.

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Semiconductors± Mixed · 4 stocks
FormFactor Inc
FORM
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Amkor's expansion intensifies competition in advanced packaging and testing.

Artificial Intelligence · 1 stocks

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