Amkor Technology IncAmkor raises Arizona advanced packaging investment to ~$12B with record Q2 revenue of $1.90B and strong Q3 guidance.
Amkor Technology is expanding its Arizona Advanced Packaging and Test Campus with a Phase 2 investment that raises total planned spending to approximately $12 billion. The Phase 2 buildout will add 60,000 square meters of cleanroom capacity, supported by customer commitments that have surpassed the 33,000 square meters planned for Phase 1. The company reported record second-quarter 2026 revenues of $1.90 billion, up 26% year over year, with Computing revenues at a record high on strong data-center demand, and it guided for third-quarter 2026 net sales of $1.95-$2.05 billion and gross margin of 18.5%-19.5%, compared with 16.8% in the second quarter. Amkor also expects full-year 2026 capital expenditures of $2.5-$3 billion, and its growth programs include 2.5D packaging, HDFO, co-packaged optics, a 10-year TSMC agreement and a multi-year NVIDIA partnership. Rivals are moving on the same opportunity: TSMC is allocating 10%-20% of its 2026 capital budget to advanced packaging, testing and related activities, while Intel is challenging Amkor with its EMIB-T technology and a growing EMIB-T backlog ahead of high-volume production supporting customer ramps in 2027.
Amkor Technology IncAmkor raises Arizona advanced packaging investment to ~$12B with record Q2 revenue of $1.90B and strong Q3 guidance.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC is allocating 10%-20% of its 2026 capital budget to advanced packaging, testing and related activities, competing in the same opportunity.
Intel CorporationIntel is challenging Amkor with EMIB-T technology and a growing EMIB-T backlog ahead of 2027 customer ramps.
NVIDIA CorporationAmkor cites a multi-year NVIDIA partnership among its growth programs.