Applied Materials IncIntroduced new chipmaking systems for advanced 3D architectures powering next-gen AI.
Applied Materials announced on June 25 the introduction of a suite of new chipmaking systems designed to build advanced 3D chip architectures that power next-generation AI. Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, noted that transistor and materials technologies previously driving performance gains in leading-edge logic are now becoming essential in DRAM, and that the distinction between logic and memory process technology is converging as DRAM scales to meet the bandwidth demands of HBM and AI workloads. In a separate development, Reuters reported on June 16 that EssilorLuxottica and Applied Materials signed a long-term deal to develop augmented reality display technology and AI glasses, with plans to scale up commercialization and focus research on advanced optical technologies.
Applied Materials IncIntroduced new chipmaking systems for advanced 3D architectures powering next-gen AI.
EssilorLuxottica S. A.Signed long-term deal with Applied Materials to develop augmented reality display tech and AI glasses.