Applied Materials IncLaunched new chipmaking systems for AI and advanced packaging, driving stock to all-time high.

Applied Materials shares surged to an all-time high of $669.22 on Thursday after the company unveiled a suite of chipmaking equipment targeting artificial intelligence and advanced packaging. The stock closed at $668, up 13.42 percent. The new products include an enhanced Centura Prime Epi system for faster, more power-efficient DRAM, three systems for critical advanced packaging steps such as real-time wafer monitoring and stress-balanced dielectric films for stacking up to 16 or more high-bandwidth memory layers, and new eBeam systems designed for a wide range of substrate geometries and materials. Prabu Raja, president of the semiconductor products group, said advanced packaging has become a primary driver of system-level performance and that the new tools give customers the ability to scale 3D stacks reliably and at yield.
Applied Materials IncLaunched new chipmaking systems for AI and advanced packaging, driving stock to all-time high.