BE Semiconductor Industries NVCompany raised long-term revenue target due to stronger hybrid bonding demand for AI packaging, with rising orders and revenue growth.

BE Semiconductor Industries raised its long-term revenue target to a range of €1.7 billion to €2.2 billion, up from the prior €1.5 billion to €1.9 billion, citing stronger hybrid bonding demand for AI packaging. The Dutch assembly equipment maker announced the new target at its 2026 Investor Day, linking the increase to improved order momentum since the second quarter of 2025, rising demand for 2.5D AI-related datacenter and photonics applications, and new hybrid bonding use cases in logic, memory, and co-packaged optics. The update followed a strong first quarter of 2026, when revenue rose 28.3% year over year to €184.9 million and orders jumped 104.5%, helped by hybrid bonding, mobile, and photonics demand. BE Semiconductor is not a memory producer, but its bonding tools place it close to the manufacturing bottlenecks behind AI memory and advanced packaging.
BE Semiconductor Industries NVCompany raised long-term revenue target due to stronger hybrid bonding demand for AI packaging, with rising orders and revenue growth.