Broadcom IncRising credit risk measures and bond yields due to AI financing guarantees increase borrowing costs and balance-sheet risk.

Bond traders increased credit risk measures for Broadcom Inc. as the company provides financial support for large AI-related financing packages. Yields on Broadcom's 5.15% bonds maturing in 2031 climbed approximately 14 basis points in August, while the company's five-year credit default swap prices rose 28 basis points during the same period, exceeding increases seen at Oracle Corp. and SpaceX. Broadcom is discussing plans to secure more than $60 billion in debt for an AI chip financing arrangement expected to support Anthropic PBC and other firms, and may guarantee part of a senior-secured portion of the deal, which remains under negotiation. Earlier this year, Broadcom agreed to backstop most of a $35 billion debt package, with investors including Apollo Global Management Inc. and Blackstone Inc. financing the purchase of custom AI chips for lease to Anthropic. Chipmakers such as Broadcom and Nvidia Corp. have increasingly used guarantees and other financial support mechanisms in 2026 as technology companies spend billions to expand cloud-computing infrastructure, but concerns have emerged that these commitments create risks not reflected on company balance sheets.
Broadcom IncRising credit risk measures and bond yields due to AI financing guarantees increase borrowing costs and balance-sheet risk.
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