Cadence Design Systems IncCadence introduces AuraStack AI Super Agent, a new AI platform for PCB and advanced packaging design, enhancing its product portfolio.
Cadence has introduced the AuraStack AI Super Agent, the world's first agentic AI platform for printed circuit board and advanced packaging design. Running on Cadence Allegro AI Studio and accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, the platform coordinates domain-specific AI agents across planning, implementation, and multiphysics analysis to deliver up to 2X faster time to market, 15X higher productivity, and multiphysics-driven quality. The AuraStack AI Super Agent unifies electrical, thermal, and mechanical analysis in a closed-loop environment, enabling real-time design convergence and reducing late-stage rework. Cadence is collaborating with NVIDIA, TSMC, Socionext, FORVIA HELLA, and Schneider Electric to deploy the technology, with availability planned for 2026.
Cadence Design Systems IncCadence introduces AuraStack AI Super Agent, a new AI platform for PCB and advanced packaging design, enhancing its product portfolio.
Taiwan Semiconductor Manufacturing Co. Ltd.
NVIDIA CorporationNVIDIA's Blackwell and CUDA-X accelerate the AuraStack platform, highlighting NVIDIA's technology adoption in EDA.
Schneider Electric S.E.Schneider Electric is named as a collaborator deploying Cadence's new AI platform, indicating potential productivity gains or partnership benefits.
Hella KGaA Hueck & Co