Corning IncorporatedCorning will showcase its multimode fiber in a high-density die-to-die optical connectivity demo for AI data centers at ECOC 2026.
Corning, Qualcomm and Lumentum plan to showcase a high-density die to die optical connectivity solution at ECOC 2026. The joint demo targets AI scale up architectures that require higher bandwidth, lower latency and tighter power budgets for chip interconnects, and the ECOC 2026 presentation will highlight massively parallel optical D2D links paired with high density fiber to support advanced AI data centers. The project taps Corning's existing role supplying fiber and optical technology to large infrastructure buyers rather than representing a completely new line of work, positioning its multimode fiber alongside Qualcomm's interface IP and Lumentum's VCSEL engines. The unresolved piece is commercial proof: the clearest early sign that this direction is working will be whether Corning starts pointing to concrete D2D or co packaged optics wins in its AI focused optical order book or in follow on agreements tied to the 2027 to 2032 style long term fiber deals already in place.
Corning IncorporatedCorning will showcase its multimode fiber in a high-density die-to-die optical connectivity demo for AI data centers at ECOC 2026.
Lumentum Holdings IncLumentum's VCSEL engines are part of the joint high-density optical D2D interconnect demo at ECOC 2026.
Qualcomm IncorporatedQualcomm's interface IP is featured in the joint high-density die-to-die optical connectivity solution for AI scale-up architectures.