Credo Technology Group Holding LtdCredo is developing a new open interconnect standard and contributing its OmniConnect spec to OCP, addressing AI memory bottleneck.
Credo Technology Group Holding Ltd. is developing a new open interconnect standard within the Open Compute Project to address the memory-wall bottleneck in AI data centers. The company has established the OCP Open Chiplet Economy Lightweight Serial Interconnect Workstream and plans to contribute its OmniConnect lightweight AXI framer specification to OCP. Credo says the technology could enable composable designs with up to 25 times greater memory density and 5% higher bandwidth than HBM4 in certain configurations. The initiative supports an open, interoperable ecosystem for connecting compute, memory and other resources more efficiently. Credo's OmniConnect technology uses an AXI-over-Very Short Reach SerDes bus for die-to-die connectivity and scale-up networking.
Credo Technology Group Holding LtdCredo is developing a new open interconnect standard and contributing its OmniConnect spec to OCP, addressing AI memory bottleneck.
Astera Labs, Inc.Astera Labs is a competitor in high-speed interconnect; the standard could affect competitive dynamics but impact unclear.
Marvell Technology Group Ltd