GalaxyCore plans private placement to raise up to 4.2 billion yuan to expand 12-inch CIS capacity

Corporate ActionProduct / Tech
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On September 19, GalaxyCore disclosed its 2026 plan for an A-share private placement to specific investors, proposing to issue up to 390 million shares to no more than 35 qualified investors, representing no more than 15 percent of the company's total share capital before the issuance, with total proceeds capped at 4.2 billion yuan. Of the funds raised, 3 billion yuan will go toward a 12-inch CIS integrated circuit specialty process expansion project, 500 million yuan toward a high-performance, high-resolution image sensor research and industrialization project, and the remaining 700 million yuan to replenish working capital. The 12-inch CIS integrated circuit specialty process expansion project has a total investment of 6.132 billion yuan, a construction period of three years, and will be carried out by GalaxyCore Semiconductor Shanghai, located in the Lingang industrial zone in Shanghai, adding monthly production capacity of 10,000 CIS image sensor wafers. The high-performance, high-resolution image sensor research and industrialization project has a total investment of 577 million yuan and a construction period of four years, focusing on the development and industrialization of 100-megapixel and 200-megapixel high-performance CIS products. The company said that by building part of a 12-inch CIS wafer specialty process line, its operating model has shifted from fabless to fab-lite, and this expansion will secure 12-inch wafer capacity supply and achieve independent control over key manufacturing steps.

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