GlobalFoundries qualifies SLATE advanced packaging on 9SW platform for next-generation RF applications

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GlobalFoundries announced production readiness of its SLATE wafer-to-wafer bonding technology on its 9SW RF-SOI platform, delivering advanced 3D integration for compact cellular front-ends. Manufactured at GF's 300mm facility in Singapore, 9SW SLATE technology is expected to ramp to volume production by the second half of 2027. The first-generation SLATE technology supports wafer-to-wafer bonding, enabling designers to bond two 9SW wafers and reduce overall die size by up to 45%, decreasing RF board space for space-constrained applications in smart mobile devices. The 9SW platform, GF's most advanced RF solution for front-end modules, delivers more than 20% enhancement in efficiency through lower on-resistance and off-capacitance. An integrated process design kit is available through the GF Connect portal, and 9SW and 9SW SLATE are available for prototyping through GF's GlobalShuttle multi-project wafer program with shuttles scheduled for the second half of the year.

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GF announces production readiness of SLATE wafer-to-wafer bonding on 9SW platform, a new technology development.

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