Globalfoundries IncSLATE 3D RF integration technology reaches production readiness, enabling advanced 3D integration for compact, high-performance cellular front-ends.

GlobalFoundries announced that its SLATE wafer-to-wafer bonding technology is now production-ready on the 9SW RF silicon-on-insulator platform at its 300mm Singapore fab, enabling advanced 3D integration for compact, high-performance cellular front-ends. This step opens a path to vertically stacked RF designs that can shrink die size by up to 45%, potentially reshaping how space-constrained 5G and satellite components are engineered. The move reinforces GlobalFoundries' specialty foundry positioning in RF, power, and differentiated platforms, though it does not materially change core risks around pricing pressure in smart mobile devices or the heavy capital needs of expanding capacity. The company's narrative projects $8.6 billion revenue and $1.3 billion earnings by 2029, assuming 8.4% yearly revenue growth and an earnings increase of about $415 million from $885.0 million today. Among recent announcements, the launch of Quantum Technology Solutions with support of up to US$375 million from the U.S. Department of Commerce highlights GlobalFoundries' push to anchor itself in specialized, higher-value technologies across RF, quantum, and photonics.
Globalfoundries IncSLATE 3D RF integration technology reaches production readiness, enabling advanced 3D integration for compact, high-performance cellular front-ends.