Guangpu Shares has postponed the scheduled availability date of its already-announced completed and operational "Optoelectronic Sensor Integrated Packaging and Testing R&D and Industrialization Project" from July 25, 2026, to June 30, 2028. The total investment for the project exceeds 184 million yuan. As of June 30, 2026, approximately 106 million yuan of raised funds were planned to be invested, with signed contracts amounting to about 72.0039 million yuan, and actual payments from raised funds totaling 56.6388 million yuan. A company representative explained that the project has indeed commenced production and is in the capacity ramp-up phase. The main reason for the delay is that the warranty deposits and final payments for large equipment have payment cycles of one to two years. If the project were closed immediately and the dedicated account canceled, the remaining payables of over 15 million yuan would need to be covered by the company's own funds. Additionally, the company plans to use the saved funds to add new equipment to align with the development of the optical communication and embodied intelligence markets, and the new equipment requires time from design to acceptance.
Xiamen Guang Pu Electronics Co LtdCompany delays completion of a major fundraising project by nearly two years, indicating capital allocation issues and potential inefficiency.