Amazon.com IncAmazon's bond yields rise and oversubscription ratio drops, increasing borrowing costs for AI capex.
Yields on corporate bonds issued by US hyperscalers to fund AI infrastructure investments are climbing. Amazon, Alphabet, Meta Platforms, and Oracle have together issued roughly 194 billion dollars so far this year through April 7, an increase of 79 percent from about 108 billion dollars for all of 2025. With this supply surge, the median spread on two- to four-year bonds has widened to 40 basis points from 30 basis points in 2025, while five- to seven-year bonds have moved to 60 basis points and bonds maturing beyond 20 years have reached 118 basis points. Of the 91 bonds issued in 2026, 78 are trading at higher yields than at issuance, with a median increase of around 22 basis points. Investor demand remains solid in absolute terms, but the cover ratio fell below two times in July from nearly five times in February, and Amazon's most recent bond offering saw the oversubscription ratio drop to about 1.6 times in July from roughly 3.4 times in March. Goldman Sachs forecasts that Amazon, Alphabet, Meta, Oracle, and Microsoft will issue around 250 billion dollars in bonds in 2026, rising to 400 billion dollars in 2027, and notes that market saturation and issuer concentration could become constraining factors.
Amazon.com IncAmazon's bond yields rise and oversubscription ratio drops, increasing borrowing costs for AI capex.
Alphabet Inc Class CAlphabet's bond yields rise and spreads widen, raising financing costs for AI investments.
Meta Platforms Inc.Meta's bond yields rise and spreads widen, increasing cost of debt for AI infrastructure.
Microsoft CorporationMicrosoft's bond yields rise and spreads widen, raising borrowing costs for AI capex.
Oracle CorporationOracle's bond yields rise and spreads widen, increasing financing costs for AI investments.