Amazon.com IncAmazon is a top-tier credit with lower borrowing costs, enabling cheaper debt financing for AI capex.
Hyperscalers are increasingly tapping the bond market to fund massive AI capital expenditures, according to Bloomberg Intelligence Senior Technology Credit Analyst Robert Schiffman. He notes a clear differentiation between top-tier corporate credits like Microsoft, Meta, Amazon, and Alphabet, and lower-rated names such as SpaceX and Oracle, with the former enjoying lower borrowing costs. To diversify funding, companies are issuing debt in alternative currencies like Canadian dollars, euros, and Swiss francs, with Alphabet even placing a 100-year bond in British pounds as a signal of balance-sheet strength. Schiffman also highlights the rise of private transactions and special purpose vehicles at the data-center level, which have raised tens of billions of dollars off the hyperscalers' anchor tenancies. With trillions of dollars in capex expected over the next few years, he anticipates more equity issuance, including converts and private placements, but emphasizes that the bulk of the spending will be financed by bondholders.
Amazon.com IncAmazon is a top-tier credit with lower borrowing costs, enabling cheaper debt financing for AI capex.
Alphabet Inc Class CAlphabet issued a 100-year bond in British pounds, signaling balance-sheet strength and low-cost funding.
Meta Platforms Inc.Meta is a top-tier credit benefiting from lower borrowing costs to fund AI capex.
Microsoft CorporationMicrosoft is a top-tier credit with lower borrowing costs, enabling cheaper debt financing for AI capex.
Space Exploration Technologies Corp. Class A Common StockArticle mentions SpaceX as a lower-rated name tapping bond market for AI capex, implying access to funding for growth.
Oracle CorporationOracle is a lower-rated credit facing higher borrowing costs compared to top-tier hyperscalers.