Intel CorporationIntel appoints Seok-Hee Lee to lead advanced packaging, a key area for AI and HPC, strengthening Intel Foundry's capabilities.

Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry to lead all advanced packaging, system integration, back-end technology development, and back-end manufacturing, reporting directly to CEO Lip-Bu Tan. The move establishes advanced packaging as a focused business within Intel Foundry, reflecting its growing importance for AI and high-performance computing. Lee joins from SK On, where he was president and CEO, and previously led SK hynix; he also held engineering roles at Intel earlier in his career. Naga Chandrasekaran remains executive vice president of Intel Foundry, continuing to oversee front-end technology development and manufacturing, including the ramp of Intel 18A and Intel 14A. Intel also announced the retirement of executive vice president Navid Shahriari after 37 years with the company.
Intel CorporationIntel appoints Seok-Hee Lee to lead advanced packaging, a key area for AI and HPC, strengthening Intel Foundry's capabilities.
SK Hynix Inc