Suzhou Jinfu New Material CoJin Fu Technology is entering AI liquid cooling supply chain with stable shipments and orders for B300 liquid cooling plate components, indicating growing end-customer demand.

Jin Fu Technology is entering the AI computing supply chain through its forward-looking layout in the liquid cooling plate sector. Leveraging its subsidiary Changshu Minglijia, the company focuses on manufacturing core components for external cold-plate liquid cooling modules, with products mainly used in HGX-type server structures corresponding to B-series chips, and has achieved stable shipments. Jin Fu Technology maintains a long-term partnership with a Taiwanese client, participating in its high-end AI server liquid cooling projects. Since the first quarter of 2026, orders for B300 liquid cooling plate components have been in normal production and delivery, and the company is assisting in the implementation of new projects in the second quarter. The company stated that the order forecast provided by the Taiwanese client does not constitute a binding purchase commitment, subsequent orders are subject to uncertainty, and the cumulative order volume for specific liquid cooling plate components currently accounts for a small proportion of total revenue. A research report from CICC predicts that the AIDC liquid cooling market will reach 114.7 billion yuan in 2026, a year-on-year increase of 273 percent.
Suzhou Jinfu New Material CoJin Fu Technology is entering AI liquid cooling supply chain with stable shipments and orders for B300 liquid cooling plate components, indicating growing end-customer demand.
China International Capital Corp Ltd