Jiuzhou Yigui plans to invest up to 630 million yuan in semiconductor wafer laser dicing production line

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Jiuzhou Yigui's wholly-owned subsidiary Jingxi Semiconductor plans to invest in an advanced semiconductor wafer laser stealth dicing industrialization project, with total investment expected not to exceed 630 million yuan. The project aims to complete production line construction and gradually commence operations by the first quarter of 2027, meeting the growing market demand for high-precision wafer dicing. In June this year, Jiuzhou Yigui acquired a 100% stake in Jingxi Semiconductor for 415 million yuan in cash and injected an additional 35 million yuan in capital. Jingxi Semiconductor focuses on advanced laser stealth dicing processing services and has successfully been integrated into 800G and 1.6T optical module production lines. Currently, the semiconductor equipment industry is accelerating domestic substitution, with laser stealth dicing technology gradually replacing traditional blade dicing machines. Since 2026, more than 60 listed companies have disclosed expansion or large-scale investment plans, making the semiconductor sector a key driver of this round of capacity expansion.

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Jingxi Semiconductor's laser stealth dicing technology is integrated into 800G and 1.6T optical module production lines, meeting growing market demand.

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