Intel CorporationIntel signs cooperation memorandum with Lens Technology to jointly advance glass substrate advanced packaging technology, which could benefit Intel's packaging capabilities.
Lens Technology and Intel have officially signed a cooperation memorandum, with both parties focusing on joint innovation in glass substrate advanced packaging technology. According to the announcement, the two sides will collaborate on through-glass via technology. Intel regards Lens Technology as a valuable potential partner in this field and will provide illustrative architecture information, design for manufacturability guidelines, benchmarking methods, and validation methods. Beyond through-glass via, the two parties will also explore cooperation in areas such as AI PC structural components and modules, data center server structural components and thermal components, embodied intelligent robots, industrial smart devices, and edge computing hardware. Lens Technology already has long-term technical accumulation in processes such as through-glass via precision processing, micro-hole formation, metallization deposition, and multi-layer interconnection, and has established a relevant pilot line, having already sent samples to some potential customers for evaluation. The company plans to construct a dedicated through-glass via glass substrate factory building with a floor area of 30,000 square meters and a full set of supporting production lines, with the project expected to officially start production by the end of 2026.
Intel CorporationIntel signs cooperation memorandum with Lens Technology to jointly advance glass substrate advanced packaging technology, which could benefit Intel's packaging capabilities.
Lens Technology Co LtdLens Technology signs cooperation memorandum with Intel to jointly develop glass substrate advanced packaging technology, leveraging its existing technical accumulation and pilot line.