Micron Technology IncMicron demonstrated the world's first 512GB DDR5 RDIMM, an R&D/product breakthrough with higher density, speed, and lower power.

Micron Technology announced the successful demonstration of the world's first 512GB DDR5 module on multiple server platforms, an ultra-dense RDIMM built on the company's advanced vertical interconnect packaging. The module stacks DRAM dies interconnected by through-silicon vias to maximize density, enabling up to 12TB of DDR5 DRAM in a single 24-slot dual-socket server, and delivers speeds up to 9,200 MT/s while cutting operating power by more than 60% compared with four 128GB RDIMMs. AMD and Intel are both actively validating the module across next-generation server platforms. Micron said the 512GB RDIMM can deliver up to 1.4 times higher performance than 256GB DDR5 configurations on memory-bound workloads such as Spark SVM-based data analytics, and offers throughput and concurrency gains for databases and caching platforms including RocksDB and Redis. Micron expects 512GB RDIMMs to enter volume production sometime in the second half of 2027, aligned to customer needs.
Micron Technology IncMicron demonstrated the world's first 512GB DDR5 RDIMM, an R&D/product breakthrough with higher density, speed, and lower power.
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