Samsung Electronics Co LtdSamsung Electronics to invest 56 trillion won in HBM packaging facilities, boosting AI chip capacity.
Samsung Group detailed plans to invest 140 trillion won, equivalent to 90 billion dollars, in South Korea's central Chungcheong province for production of display panels, batteries, chips, and chip materials. Samsung Display will spend 67 trillion won in Asan and Cheonan, while Samsung Electronics will invest 56 trillion won to build packaging facilities for high-bandwidth memory chips in Onyang and Cheonan. Samsung SDI will spend 9 trillion won by 2040 in Cheonan for next-generation battery production and research and development. Samsung Electro-Mechanics will invest 8 trillion won by 2040 in Sejong to produce advanced chip packaging materials for AI servers and nurture domestic talent. The plan fits into bigger investment plans the group rolled out on Monday, with details provided by Samsung Display CEO Yi Chung at an event hosted by President Lee Jae Myung.
Samsung Electronics Co LtdSamsung Electronics to invest 56 trillion won in HBM packaging facilities, boosting AI chip capacity.
Samsung Electro-MechanicsSamsung Electro-Mechanics to invest 8 trillion won by 2040 in advanced chip packaging materials for AI servers.
Samsung SDISamsung SDI to invest 9 trillion won by 2040 in next-gen battery production and R&D.