SK Hynix IncSK Hynix breaks ground on $4B HBM plant, expanding capacity and securing future supply.
SK Hynix broke ground Thursday on an approximately $4 billion high-bandwidth memory packaging and research complex in West Lafayette, Indiana, marking its first U.S. advanced HBM packaging hub. The 133.5-acre campus, supported by up to $458 million in CHIPS Act grants and as much as $500 million in loans, is expected to begin operations in the second half of 2028 and support roughly 7,000 direct and indirect jobs. HBM is a critical component in Nvidia-powered AI systems, and SK Hynix is betting on sustained demand, especially after Nvidia reported fiscal second-quarter revenue of $96.2 billion, up 106% year over year, with Data Center revenue surging 117% to $89 billion. The project aims to lock in capacity for the next phase of AI spending, but the long timeline poses risks from potential AI investment slowdowns or increased competition from Samsung and Micron.
SK Hynix IncSK Hynix breaks ground on $4B HBM plant, expanding capacity and securing future supply.
Micron Technology IncSK Hynix's new US HBM plant increases competition for Micron in the HBM market.
Samsung Electronics Co LtdSK Hynix's new plant intensifies competition for Samsung in the HBM market.
NVIDIA CorporationSK Hynix's HBM plant supports Nvidia's AI systems, and Nvidia's strong revenue growth indicates sustained demand.