SK Hynix Inc000660
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SK Hynix shipped next-gen HBM4E samples, showing product advancement.
SK Hynix has shipped samples of its next-generation HBM4E memory chips to major customers. The South Korean chipmaker said the 12-layer HBM4E achieves a maximum data processing speed of 16 Gbps per pin and improves power efficiency by more than 20% over previous models. Heat resistance has also been enhanced by 17% compared to the preceding HBM4, enabling stable operation in high-performance computing environments. The company plans to work closely with partners for timely mass production.
SK Hynix IncSK Hynix shipped next-gen HBM4E samples, showing product advancement.
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