Soitec SASoitec will supply its Power-SOI substrates for high-volume production, driving demand for its engineered substrates.

Soitec and ZenSemi have announced a strategic collaboration to enable high-volume production of 300mm BCD-on-SOI technologies for next-generation power electronics. Soitec will supply its advanced 300mm Power-SOI substrates to support ZenSemi’s development and capacity ramp-up of a new BCD-on-SOI process, targeting applications such as AI datacenters, electric vehicles, humanoid robots, and industrial systems. The partnership aims to provide fabless companies and integrated device manufacturers with a high-performance manufacturing platform, leveraging Soitec’s engineered substrate expertise and ZenSemi’s specialty foundry capabilities. ZenSemi reported successful first-silicon validation with a lead customer, achieving a roughly 30% die size reduction for an 18-channel analog front-end device compared to traditional bulk BCD processes. The companies plan to rapidly scale 300mm SOI-BCD manufacturing capacity to serve both domestic Chinese design houses and global clients.
Soitec SASoitec will supply its Power-SOI substrates for high-volume production, driving demand for its engineered substrates.
ZenSemi achieved first-silicon validation with a lead customer, demonstrating a 30% die size reduction for its BCD-on-SOI process.