Soitec and ZenSemi partner on 300mm BCD-on-SOI production for next-generation power electronics

Product / TechM&A · Partnership
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Soitec and ZenSemi have announced a strategic collaboration to enable high-volume production of 300mm BCD-on-SOI technologies for next-generation power electronics. Soitec will supply its advanced 300mm Power-SOI substrates to support ZenSemi's development and capacity ramp-up of a new BCD-on-SOI process, targeting applications such as AI datacenters, electric vehicles, humanoid robots, and industrial systems. The partnership aims to provide fabless companies and integrated device manufacturers with a high-performance manufacturing platform that leverages full dielectric isolation to eliminate parasitic latch-up and reduce electrical crosstalk, allowing dense integration of high-voltage power stages and low-voltage control circuitry on a single chip. ZenSemi reported successful first-silicon validation with a flagship lead customer, achieving an approximately 30% die size reduction for an 18-channel analog front-end device compared to traditional bulk BCD processes. The collaboration will rapidly ramp ZenSemi's 300mm SOI-BCD manufacturing capacity to serve both domestic Chinese design houses and worldwide clients in automotive, artificial intelligence, and industrial markets.

Impact on stocks 1

Semiconductors▲ · 1 stocks
Soitec SA
SOI
▲ PositiveDemandrelevance

Soitec will supply advanced 300mm Power-SOI substrates for ZenSemi's high-volume BCD-on-SOI production, driving demand for its substrates.

Theme Impact 6

Off-coverage companies 1

ZenSemiPrivate▲ Positive
Technologyrelevance

ZenSemi successfully validated first silicon with a lead customer, achieving 30% die size reduction, and is ramping 300mm SOI-BCD capacity.

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