Spirox CorpSpirox launched the SP7000G, a new product for high-speed TGV inspection, enhancing its product portfolio.

Spirox has launched the SP7000G High-Speed TGV Crack Inspection System, designed to support high-volume glass substrate inspection for next-generation AI and HPC packaging. The system can scan a full 510 mm by 515 mm glass substrate in under 20 minutes, detecting internal microcracks after metallization and ABF build-up processes. Spirox introduced the system at its Advanced Packaging Technology Forum, where experts from Corning and DNP discussed Glass Core and TGV technologies. The SP7000G complements Spirox's existing SP8000G, offering a comprehensive solution for non-destructive TGV inspection across R&D, quality control, and high-volume manufacturing.
Spirox CorpSpirox launched the SP7000G, a new product for high-speed TGV inspection, enhancing its product portfolio.
Corning Incorporated
Compal Electronics Inc