Globalfoundries IncGlobalFoundries will receive up to $300 million for co-packaged optics R&D.
The Commerce Department has signed letters of intent to provide $874 million in CHIPS and Science Act incentives to seven companies advancing semiconductor technologies for AI and high-performance computing. GlobalFoundries will receive up to $300 million to accelerate U.S. R&D of co-packaged optics, while Kepler will receive up to $245 million to develop advanced AI memory technology using 3D and ferroelectric technologies. Multibeam Corporation is set to receive up to $140 million for advanced chip packaging, and Extropic, Thintronics, OBSIDIA Semiconductors, and Aeluma would receive investments ranging from $30 million to $75 million for projects in low-power computing, advanced materials, and counterfeit detection. The companies have signed preliminary agreements pending further review, and the government will receive minority, non-controlling equity stakes in return. This follows the Trump administration's award of nearly $2 billion in CHIPS Act funding to nine companies in May, including $1 billion to International Business Machines Corp. and $375 million to GlobalFoundries.
Globalfoundries IncGlobalFoundries will receive up to $300 million for co-packaged optics R&D.
Aeluma, IncAeluma is set to receive CHIPS Act funding for counterfeit detection projects.
International Business MachinesIBM previously received $1 billion in CHIPS Act funding, mentioned as context.
Multibeam is set to receive up to $140 million for advanced chip packaging.
Thintronics would receive funding for advanced materials projects.
Extropic is set to receive $30-75 million for low-power computing projects.
OBSIDIA Semiconductors is set to receive $30-75 million for advanced materials projects.