Taiwan Semiconductor Manufacturing Co. Ltd.TSMC accelerates capex for 3nm capacity expansion, driven by strong AI demand, with 3nm gross margin expected to exceed company average by H2 2026.
Taiwan Semiconductor Manufacturing Company is accelerating capital spending to expand global capacity for 3-nanometer FinFET technologies, driven by strong AI demand. The company is adding a new 3-nanometer fab at its GIGAFAB cluster in Tainan Science Park with volume production set for the first half of 2027, while its second Arizona fab will begin 3-nanometer volume production in the second half of 2027, and its second Japan fab will utilize the technology with volume production scheduled for 2028. TSMC is also converting 5-nanometer tools to support 3-nanometer capacity in Taiwan and expects N3 gross margin to exceed the corporate average in the second half of 2026. The investment marks a departure from the company's past practice of limiting capacity additions once a node reaches its target.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC accelerates capex for 3nm capacity expansion, driven by strong AI demand, with 3nm gross margin expected to exceed company average by H2 2026.
Globalfoundries IncTSMC's aggressive 3nm expansion intensifies competition in advanced foundry, pressuring Globalfoundries which lacks 3nm plans.