Taiwan Semiconductor Manufacturing Co. Ltd.TSMC gains a dedicated packaging partner in Arizona, enhancing its service offering and supply chain resilience.
Taiwan Semiconductor Manufacturing Company and Amkor Technology have entered into a 10-year partnership to expand advanced semiconductor packaging and testing capabilities in Arizona. The collaboration will see Amkor provide advanced packaging services for chips produced at TSMC's Arizona facilities, aiming to strengthen the US semiconductor supply chain and meet rising demand for high-performance computing and AI solutions. The integrated model is designed to increase regional capacity and significantly reduce time-to-market for customers requiring sophisticated system-level integration. The agreement reinforces both companies' commitments to long-term investment in Arizona's high-tech sector, creating a more resilient ecosystem from silicon fabrication to final testing.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC gains a dedicated packaging partner in Arizona, enhancing its service offering and supply chain resilience.
Amkor Technology IncAmkor will provide advanced packaging services for TSMC's Arizona chips, securing long-term demand.
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