TSMC and ASML Team Up to Expand Large-Format Photomasks for High NA EUV

Product / TechIndustry Impact 4
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Summary · why it matters

Taiwan Semiconductor Manufacturing Company, or TSMC, is teaming up with ASML Holding N.V. to advance the semiconductor industry's shift toward larger-format extreme ultraviolet photomasks. The companies established the industrywide initiative on Sept. 7, ahead of the annual SPIE BACUS Conference in Monterey, CA, aiming to establish a 12-inch mask pilot line by 2031 and pave the way for 12-inch High-NA lithography systems to enter advanced-node production by 2033. While High Numerical Aperture EUV will initially be adopted for production using the current 6-inch masks, the transition to larger 12-inch masks is expected to boost fab productivity, lower chipmaking costs and eliminate stitching constraints across the semiconductor industry. TSMC plans to use ASML's High-NA technology in high-volume manufacturing for advanced nodes starting in 2030, and expects more layers to require High NA EUV as nodes advance, primarily because of increasingly complex transistor architectures needed for AI applications. Separately, Intel Foundry and ASML said High NA is now being used in high-volume manufacturing, with more than one million wafers processed to date across early tool certification and testing, research and development, and volume production on select layers for a subset of Intel Core Ultra Series 3 processors, code-named Panther Lake.

Impact on stocks 3

Semiconductors · 3 stocks
ASML Holding N.V.
ASML
▲ PositiveTechnologyrelevance

ASML is the partner advancing larger-format High-NA EUV photomasks and its High-NA tools are entering high-volume manufacturing at Intel and planned at TSMC.

Intel Corporation
INTC
▲ PositiveTechnologyrelevance

Intel Foundry and ASML said High NA EUV is now in high-volume manufacturing, with over one million wafers processed and use on select layers of Panther Lake Core Ultra Series 3 processors.

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