TSMC Q2 Revenue Jumps 36% as CoWoS Packaging Bottleneck Drives Pricing Power

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Summary · why it matters

Taiwan Semiconductor Manufacturing reported second-quarter 2026 EPS of $4.31 against a $3.8866 estimate, a 10.89% beat, on revenue of $40.2 billion, up 36.0% year over year, with gross margin of 67.7%, up 9.1 percentage points year over year. Advanced nodes at 7nm and below accounted for 77% of wafer revenue, with 3nm at 30%, 5nm at 33%, and 2nm debuting at 3% in its first commercial quarter. August monthly revenue rose 53.3% year over year, and management raised full-year 2026 growth guidance to slightly above 40% year over year in U.S. dollar terms. Management said packaging capacity is so tight that it is now a little bit of customers' growth, pointing to the CoWoS advanced packaging step as the industry's real choke point. The company guided that the steep 2nm ramp will dilute third-quarter gross margin by about 3 to 4 percentage points, while citing an additional $100 billion U.S. investment and a total Arizona commitment of $265 billion, $110 billion in cash and marketable securities, a 2024 to 2029 revenue CAGR approaching 25% in USD, and a long-term gross margin above 56%.

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Semiconductors▲ · 3 stocks
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