TTM Technologies IncOpens new Ultra-HDI facility with $130M investment, including $30M from U.S. Department of War, creating jobs and expanding capacity.

TTM Technologies has opened a new Ultra-High-Density Interconnect printed circuit board manufacturing facility in Syracuse, New York, advancing America's defense electronics industrial base. The 215,000-square-foot facility, purpose-built for Ultra-HDI PCB and advanced packaging production, represents a $130 million investment, including $30 million from the U.S. Department of War. It will create up to 400 new engineering and manufacturing jobs, bringing TTM's total Central New York workforce to approximately 1,000 employees. The facility addresses a critical gap in domestic production capacity for Ultra-HDI PCBs, which are essential for next-generation radar, missile defense, space, and autonomous systems programs.
TTM Technologies IncOpens new Ultra-HDI facility with $130M investment, including $30M from U.S. Department of War, creating jobs and expanding capacity.