United Microelectronics Corporation2303
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UMC raised 2026 capex to $2B and approved $5B for fab construction, signaling growth investment.
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Cramer Says Broadcom Has More Orders Than Almost Anyone But NVIDIA
Jim Cramer said Broadcom CEO Hock Tan told him demand for AI compute infrastructure remains extremely strong and durable, with the custom chip designer holding more orders than almost anybody other than Jensen Huang. Cramer's remarks on CNBC center on whether Broadcom can keep capturing custom AI chip orders, and the third quarter earnings released on September 2nd support the growth narrative, with revenue up 86%, AI semiconductor revenue up 221%, and fiscal year 2026 guidance implying 186% annual AI revenue growth. Tan reaffirmed that Broadcom could pull in $115 billion in annual AI chip sales in 2027 and $230 billion in 2028. Still, the fiscal fourth quarter guide left investors wanting more, with $34.8 billion in revenue missing analyst estimates of $35.03 billion and gross margin guided at 73%, a five point annual drop due to a higher mix of XPU sales. Estimates suggest 71% of Broadcom's fiscal 2027 and 2028 XPU deployment could rely on OpenAI and Anthropic, meaning a huge portion of orders might come from firms now calling for a slowdown in AI development. In Q2, 170 out of the 1,006 funds tracked by Insider Monkey held a stake in Broadcom, a slight drop from 163 out of 1,022 funds in Q1, with notable exits including Third Point and Two Sigma Advisors, and the stock trades at a forward P/E ratio of 18 versus NVIDIA's 23.42.
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Intel and SK Hynix Explore US Memory Chip Partnership as Shares Surge
Intel and SK Hynix are exploring partnership opportunities to manufacture memory chips in the United States, reportedly centered on Intel's long-delayed Ohio manufacturing complex, with possibilities ranging from SK Hynix leasing capacity to a broader joint venture involving cloud companies. No formal partnership has been announced, and SK Hynix stressed that no specific plans or arrangements have been finalized. Since reports of the potential partnership surfaced Wednesday, Intel shares have surged roughly 10%, while SK Hynix has climbed about 5%; SK Hynix stock has risen 20% since its U.S. Nasdaq debut in July, while Intel is up about 4% over the same period. Intel's turnaround is gaining traction independently, with Q2 revenue jumping 25% year over year to $16.1 billion, Data Center and AI revenue surging 59% to $6.3 billion, Intel Foundry revenue up 31%, and management guiding Q3 sales to $15.8-$16.8 billion, while the Zacks Consensus calls for fiscal 2026 revenue to rise nearly 18% and FY26 EPS to soar to $1.50 from $0.42 per share last year. SK Hynix reported record Q2 performance amid robust AI demand, began mass shipments of HBM4 with production expected to ramp through the second half of the year, and shipped samples of HBM4E, while the Zacks Consensus Estimate calls for FY26 revenue to soar over 250% to $240.09 billion and EPS to jump more than 500% to $25.69. Despite its AI-memory leadership, SK Hynix trades at a forward P/E multiple of 7X, while Intel trades at more than 100X forward earnings; SK Hynix carries a Zacks Rank #2 (Buy), while Intel holds a Zacks Rank #3 (Hold).
Tesla Seeks Federal Ruling Over Terafab Name for $16.8 Billion Chip Complex
Tesla and SpaceX are seeking a federal ruling that the Terafab name does not infringe trademark rights held by TERA-print, adding a legal fight to the company's planned $16.8 billion chip complex. Tesla filed three Terafab-related trademark applications in May, and the planned Texas operation would manufacture, package and test advanced logic and memory chips for Optimus robots, Cybercabs and SpaceX data centers. Tesla shares slipped roughly 1% to $362.84 on Friday. The stock trades 8.66% above its $333.92 GF Value, indicating investors still pay a premium for Tesla's long-term growth ambitions. The larger question is whether Tesla can turn the $16.8 billion capital commitment into reliable semiconductor output, since bringing chip production in-house adds execution risk around yields, utilization, engineering talent and manufacturing discipline.