MediaTek IncXiaomi's chip reduces reliance on MediaTek, increasing competitive pressure.
Xiaomi unveiled its new Xring O3 smartphone processor on Monday, with TSMC manufacturing it on 3-nanometer technology, according to a Reuters report. Two sources said the chip is expected to be used in Xiaomi's new flagship foldable smartphone, with a shipment target of around 200,000 to 300,000 units. The launch comes one year after the first Xring O1 chip and reflects efforts to reduce reliance on Qualcomm and MediaTek amid intensifying competition in the premium smartphone market. Xiaomi also disclosed that it has commissioned TSMC to produce two more Xring chips: the Xring O100, a 6-nanometer Neural Processing Unit designed to support the MiMo large language model, and the Xring D100, with both models scheduled to enter use next year.
MediaTek IncXiaomi's chip reduces reliance on MediaTek, increasing competitive pressure.
Qualcomm IncorporatedXiaomi's new chip reduces reliance on Qualcomm, intensifying competition in premium smartphones.
Taiwan Semiconductor Manufacturing Co. Ltd.TSMC secures orders for Xiaomi's Xring O3 and two additional chips.
Xiaomi CorpXiaomi unveils Xring O3 chip, a new product development.