Yingliu Shares completed the issuance of its second tranche of technology innovation bonds for 2026 on August 20, 2026. The issuance size was 500 million yuan, with a term of three years and a coupon rate of 1.93 percent. The bond is abbreviated as 26 Yingliu MTN002 Technology Innovation Bond, with code 102683195. The interest accrual date is August 20, 2026, and the repayment date is August 20, 2029. The issue price was 100 yuan per 100 yuan face value, and all raised funds were received in full on the same day. This tranche was publicly issued in the national interbank bond market through bookbuilding and centralized allocation, and the raised funds will be mainly used to repay interest-bearing liabilities.
Anhui YingliuCompleted 500 million yuan bond issuance to repay interest-bearing liabilities, improving financial position.
