YOUZU Interactive Co LtdYouzu Interactive partners to establish advanced packaging center, enhancing its technology capabilities in 2.5D/3D packaging.

Youzu Interactive disclosed on August 12 that it has reached a cooperation with Kangying Semiconductor and Sunrise to jointly establish a 2.5D and 3D advanced packaging center in the Wuxi National Hi-tech District. The center will be built in three phases, and upon full completion will form a complete advanced packaging system covering key technologies such as bumping processes, wafer-level packaging, fan-out packaging, and 2.5D and 3D heterogeneous integration. The project will bring in a senior expert team with backgrounds at world-class packaging and testing companies such as TSMC and ASE, focusing on advanced packaging processes like CoWoS, and providing high-quality mass production packaging services to customers in fields such as computing power chips and memory chips. Youzu Interactive stated that this cooperation aims to break overseas technology monopolies through back-end process innovation and enhance China's independent supply capability in the advanced packaging field. The Wuxi National Hi-tech District Administrative Committee will provide comprehensive support in areas such as land and factory facilities, preferential policies, talent assurance, financial support, and industrial coordination.
YOUZU Interactive Co LtdYouzu Interactive partners to establish advanced packaging center, enhancing its technology capabilities in 2.5D/3D packaging.
Kangying Semiconductor collaborates to build advanced packaging center, expanding its technological footprint.