Semiconductors▲
Weihong Launches Ultrafast Laser Cutting and Cleaving Integrated Solution, Entering Glass Substrate Processing
Weihong recently released an ultrafast laser cutting and cleaving integrated solution, officially entering the precision processing of glass substrate base materials. The solution integrates femtosecond or picosecond ultrafast lasers with Bessel beam shaping technology to achieve nanoscale precision micro-modification, and features self-developed PSO functionality triggered by physical spatial distance to improve cross-section consistency and yield. The accompanying ULC100 laser controller is based on EtherCAT bus and supports dual-laser synchronized control. The solution is currently adapted for cutting base materials such as OLED flexible glass substrates and semiconductor packaging carriers, with applications spanning semiconductor chips, photovoltaic new energy, and next-generation display panels. The company stated that the next step will be to advance R&D on large-format integrated cutting and cleaving production lines and five-axis PSO technology.