Critical Materials & Supply Chain▲
Semiconductor alloy solder powder market to reach $1.2 billion by 2030
The global semiconductor alloy solder powder market is projected to grow from $0.91 billion in 2026 to $1.2 billion by 2030, at a compound annual growth rate of 7%, according to a new report from ResearchAndMarkets.com. The market expanded from $0.86 billion in 2025 to $0.91 billion in 2026, a 6.8% increase, driven by semiconductor manufacturing expansion, rising consumer electronics demand, and advancements in electronic packaging. Growth is further fueled by electric vehicle electronics, miniaturized components, and high-performance computing, with key trends including lead-free solder powders and fine particle size powders for advanced packaging. North America led the market in 2025, while Asia-Pacific is expected to be the fastest-growing region. Major players include Henkel AG & Co. KGaA, DOWA Holdings Co. Ltd., Tamura Corporation, and Indium Corporation of America, which recently introduced SiPaste C312HF for system-in-package applications and acquired SAFI-Tech to enhance its nanosilver sintering technology.