ROHM Company Limited

ROHM Semiconductor has developed 4th Generation 650V IGBTs for automotive electric compressors, HV heaters, and industrial equipment inverters. The new automotive-grade devices achieve class-leading low conduction loss with VCE(sat) of 1.55V, provide 7 microseconds short-circuit withstand time at 25 degrees Celsius junction temperature, and comply with the AEC-Q101 automotive reliability standard. The lineup includes 12 products in the TO-247N package and 10 bare wafer products, with 12 additional TO-247-4L package products under development. ROHM plans to further expand the lineup with compact surface-mount IGBTs using TO-263L and top-side cooling packages.

ROHM Semiconductor has developed a new evaluation board, the BD83070GWL-EVK-002, designed to showcase its BD83070GWL buck-boost DC-DC converter IC. The board achieves an ultra-compact mounting area of 12.87 square millimeters, integrating the IC with a coil, capacitors, and a total of only five components. The BD83070GWL IC itself delivers up to 97% efficiency and an ultra-low quiescent current of 2.8 microamps, targeting small battery-powered devices such as wearables, mobile devices, and IoT products. As a reference design, circuit patterns and the bill of materials are publicly available to ease the transition from evaluation to mass production. The board is now available for purchase through online distributors including DigiKey and Farnell.

Mitsubishi Electric, Toshiba, and Rohm are aiming to reach an agreement by September to combine their power-chip businesses into a joint venture that would integrate sales, manufacturing, and development, with Mitsubishi Electric tentatively expected to lead the merged entity. Mitsubishi Electric CEO Kei Uruma said the companies are working through final terms and hope to announce plans by September, believing the deal could strengthen their ability to compete with major global rivals and possibly reach the top position in power-semiconductor market share. Each of the three companies currently holds less than 5% of the global power-semiconductor market, while Infineon Technologies controls nearly one-fifth, according to Omdia. The companies still need to resolve disagreements over the product scope, as Toshiba and Rohm want to include analog chips such as converters and drivers, while Mitsubishi Electric prefers a tighter focus on power chips. Uruma also noted that Japan's government subsidy rules require at least 200 billion yen, or about $1.2 billion, in investments involving other companies to qualify for support, a requirement he called too demanding, and warned that without similar assistance the combined venture's costs could remain higher than those of overseas competitors.

ROHM Semiconductor has developed new 600V Super Junction MOSFET series, the R60xxXNx and R60xxWNx, now available in surface-mount DFN8080-5L and TOLL packages. The lineup includes 21 high-speed switching models and 11 PrestoMOS models with class-leading high-speed recovery characteristics, targeting power supplies for AI servers and industrial equipment. The gate threshold voltage is set to a 3V to 5V range for broad compatibility, while improved admittance characteristics reduce loss compared to previous series. Mass production began in June 2026, with TOLL package products already available through online distributors like DigiKey.

ROHM Semiconductor has developed the AG16xFNxx Series, a lineup of 80V power MOSFETs for automotive 48V power supply systems. The new products adopt the HPLF5060 and DFN3333 packages, enabling downsizing compared to standard automotive MOSFET packages such as the TO-252. The HPLF5060 features Gull-Wing Leads and the DFN3333 features Wettable Flank Technology, while Copper Clip Junction Technology enhances heat dissipation for high-current handling. All models comply with AEC-Q101, and mass production began in April 2026 for the AG160FNS4FRA and AG166FNH7FRA, with online sales available through distributors like DigiKey and Farnell. ROHM plans to further expand the lineup and has started development of TOLG packaged products.