TSMC Sets Up Advanced Packaging Hub in Kaohsiung

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Taiwan Semiconductor Manufacturing is establishing an advanced-packaging testing and training hub in Kaohsiung that will let suppliers test equipment and materials alongside the chipmaker before those technologies reach production. Two buildings are expected to open in late 2029, and TSMC has said the setup could make validation 25% to 50% more efficient. The company's U.S. shares rose about 0.4% to $453.02 around 10:28 a.m. ET Friday, based on Thursday's $451.15 close. The article notes that faster testing is not the same as more chips ready to sell, and that the shares sit 24.45% above GuruFocus's $364.01 GF Value estimate.

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