Aeluma, IncSigned letter of intent for up to $30M CHIPS Act R&D funding, supporting its semiconductor manufacturing platform.

Aeluma has signed a letter of intent with the U.S. Department of Commerce for up to $30 million in proposed funding under the CHIPS and Science Act. The award would support research and development of Aeluma’s scalable, non-InP semiconductor manufacturing platform for photonics, targeting applications in AI, advanced computing, and national security. The funding is part of broader CHIPS R&D incentives aimed at strengthening domestic semiconductor capabilities and supply chain resiliency. The letter of intent contemplates a portion of the award being funded upfront, with the remainder tied to milestone-based project costs and technical progress. Finalization of the award remains subject to further due diligence, government approvals, and execution of definitive documents.
Aeluma, IncSigned letter of intent for up to $30M CHIPS Act R&D funding, supporting its semiconductor manufacturing platform.