ASML Holding N.V.ASML expanded High-NA EUV collaborations with Samsung and Intel, with advanced foundry Logic revenue expected to rise ~25% and Memory revenue 75% in 2026.
ASML Holding NV is expanding its High-NA EUV customer collaborations with Samsung Electronics and Intel as AI-related chip demand raises manufacturing complexity. On Tuesday, ASML expanded its long-standing partnership with Samsung around High-NA EUV and advanced semiconductor manufacturing, and that same day extended its collaboration with Intel on future scaling needs, including larger-format masks. Intel has already moved High-NA into production, helping Intel Foundry in Panther Lake production and qualifying the technology on select 18A product layers, which ASML's second-quarter presentation described as a new readiness milestone. Samsung is joining an industry initiative to develop a 12-inch photomask platform for High-NA EUV and plans to introduce ASML's High-NA technology into future DRAM high-volume manufacturing by 2028. In the first quarter of 2026, the High-NA platform had processed more than 0.5 million wafers and achieved availability above 80%, while ASML expects advanced foundry Logic revenue to rise about 25% in 2026, Memory revenue to increase 75% and EUV revenue to grow about 45%. Management still expects discussions with all customers on exactly how and when High-NA will enter high-volume manufacturing, leaving the pace of wider adoption dependent on customer qualification and manufacturing decisions.
ASML Holding N.V.ASML expanded High-NA EUV collaborations with Samsung and Intel, with advanced foundry Logic revenue expected to rise ~25% and Memory revenue 75% in 2026.
Intel CorporationASML extended its High-NA EUV collaboration with Intel, which has moved High-NA into production for Panther Lake and qualified it on 18A layers.
Samsung Electronics Co LtdASML expanded its High-NA EUV partnership with Samsung, which will adopt the tech for future DRAM high-volume manufacturing by 2028.
Samsung Electronics Co LtdSamsung is joining an industry initiative for a 12-inch photomask platform and plans to introduce ASML's High-NA technology into DRAM production by 2028.