Micron Technology IncCXMT's HBM3E progress could increase competitive pressure on major suppliers like Micron.
Chinese memory-chip maker CXMT has begun small-scale production of HBM3E, an advanced high-bandwidth memory used in AI chips, according to a report from The Information. The company plans to expand production in 2027, and multiple Chinese chip designers, including Alibaba's T-Head and Cambricon Technologies, are testing the memory for potential use in products as early as next year. While CXMT's HBM3E lags behind leaders like SK Hynix and Micron in yield and technology, its progress indicates China is narrowing the gap in the AI-memory market, which could eventually increase competitive pressure on major suppliers such as Micron, Sandisk, and SK Hynix.
Micron Technology IncCXMT's HBM3E progress could increase competitive pressure on major suppliers like Micron.
SK Hynix IncCXMT's HBM3E progress narrows China's gap and could add competitive pressure on SK Hynix.
Sandisk CorpArticle names Sandisk among major suppliers facing eventual competitive pressure from CXMT's HBM3E.
Alibaba Group Holding LtdAlibaba's T-Head is testing CXMT's HBM3E for potential use in products as early as next year.
Astera Labs, Inc.CXMT has begun small-scale production of advanced HBM3E memory chips, a technology milestone for the company.
Cambricon Technologies Corp LtdCambricon is testing CXMT's HBM3E for potential use in products as early as next year.