MACOM Technology Solutions Holdings IncMACOM introduced a new packaging technology (hot via chip scale) and a product using it, reinforcing its position in high-speed components for AI networking.

MACOM Technology Solutions introduced its hot via chip scale technology, a packaging process built on AlGaAs diode technology that eliminates traditional wire bonds. The process routes RF signal and ground paths vertically through the die, simplifying surface-mount assembly, reducing parasitics, and improving manufacturing consistency for reliable performance into millimeter-wave frequencies. Its first product using the process is the MASW-011261, a broadband SP2T switch operating from 60 to 110 GHz, with 0.9 dB typical insertion loss, 30 dB isolation, and sub-20 ns switching. The release reinforces MACOM's position in high-speed semiconductor components used across optical networking and data-center infrastructure.
MACOM Technology Solutions Holdings IncMACOM introduced a new packaging technology (hot via chip scale) and a product using it, reinforcing its position in high-speed components for AI networking.
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