Mizuho Says Intel Has a Cost Edge Over TSMC in Advanced Chip Packaging

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Mizuho analysts said Intel's EMIB-T technology holds a cost advantage over TSMC's CoWoS-L in the advanced chip packaging race, following an expert call on the topic. The firm raised its price target on Intel to $135 from $128 while keeping a Neutral rating, citing growing strength in advanced packaging as a potential long-term revenue driver. Both EMIB-T and CoWoS-L are gaining traction and are seen as front-runners in 2.5D packaging, but Intel will need to achieve 99% production yields to fully convert its cost edge into market share. Mizuho also highlighted Intel's Foveros 3D stacking technology and emerging glass substrate materials as additional tools that could help the company capture 10% to 15% of the advanced packaging market over time.

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Intel's EMIB-T technology has a cost advantage over TSMC's CoWoS-L in advanced chip packaging, with potential to capture 10-15% market share.

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