ON Semiconductor Corporationonsemi unveiled its Embedded Power Platform, a new architecture delivering up to 3-5x higher power density for automotive and AI applications.
onsemi has introduced the Embedded Power Platform, a new architecture that uses the silicon wafer itself as the package and integrates multiple dies into a single silicon device. The platform enables up to 3 to 5x higher power density compared with current solutions and can accelerate development cycles to as little as four months, according to the company. In an early solid-state circuit-breaker design, the EPP-based solution was approximately 50% smaller and 20% cooler than existing designs, while electric vehicle traction inverters can achieve up to 4x higher power density and 15% lower power losses. Subaru Corporation is one of the first early engagement partners for EPP, working with onsemi to evaluate how the platform could support future electrified vehicle architectures, with early access to engineering samples, simulation models and technical expertise. EPP is expected to begin sampling in 2026 with strategic customers and ecosystem participants across automotive and AI applications.
ON Semiconductor Corporationonsemi unveiled its Embedded Power Platform, a new architecture delivering up to 3-5x higher power density for automotive and AI applications.
Subaru is one of the first early engagement partners for onsemi's EPP, evaluating the platform for future electrified vehicle architectures.