Qualcomm IncorporatedQualcomm is exploring a new chip architecture (HPC) that offers significant performance improvements, which could enhance its competitive position in mobile, PC, and automotive markets.

Qualcomm is exploring the use of its new High Bandwidth Compute chip architecture for mobile devices, Executive Vice President Durga Malladi told Semafor. The technology stacks chips vertically rather than side by side to enable faster data transfer, and Malladi said the company has discussed its application with smartphone, PC, and automotive manufacturers. Earlier this week, Qualcomm executive Tony Pialis stated that HPC delivers six times the bandwidth per watt compared to GPU/HBM/SRAM solutions, breaking through the memory bottleneck by separating HBM from the GPU to achieve lower energy per token and higher memory bandwidth.
Qualcomm IncorporatedQualcomm is exploring a new chip architecture (HPC) that offers significant performance improvements, which could enhance its competitive position in mobile, PC, and automotive markets.